GBP
The ATTEND 125B-78C00 is a high-density MXM 3.0 connector designed to support today's embedded computing modules, such as SMARC, EDM, Apalis, and PCIe-based systems. Its compact 0.50 mm pitch and 314-pin configuration enable a reduced PCB footprint while delivering the reliable signal integrity required in high-performance B2B and industrial applications.
Moreover, this connector is built on robust engineering, featuring a low-profile height of 7.8 mm, which extends the module mating surface 5 mm above the main board, thereby eliminating the need for costly board cutouts.
Unique Features of this MXM 3.0 Connector Include
- Connector Type: MXM 3.0 (edge card), 314 female contacts
- Height: 7.8 mm; module mating height 5.0 mm
- Mounting Style: Surface-mount, right-angle, SMD
- Insulation Material: Liquid Crystal Polymer (LCP), UL94 V‑0 rated
- Contact Material: Copper alloy with gold plating (typical thickness ~5 µin / 0.127 µm)
- Operating Range: −40 °C to +85 °C
- Durability: ~30 mating cycles, suitable for robust deployment
Benefits You Get
- Saves PCB real estate and reduces carrier board complexity due to its laser‑precise low‑profile design.
- Ensures high-speed signal fidelity across various interfaces in compact and rugged embedded applications.
Product Use Cases
- Embedded edge computing
- Industrial controllers
- Telematics
- AI accelerators
- Gaming systems