GBP
The Attend Technology 115Q BCA0 is a Micro SIM card socket designed for compact wireless and embedded designs that need reliable removable identity storage. It utilizes a push-push mechanism with an integrated card detect switch for clean insertion and ejection control, and features a surface-mount right-angle design to conserve z-height on dense boards. Contacts are gold-plated for stable, low resistance in mobile, telemetry, and industrial devices.
Materials and Build Quality
- Housing LCP UL94 V0 black for thermal stability during reflow.
- Contacts are made of copper alloy C5210R with a nickel underplate and gold plating on the contact and tail areas.
- These choices resist wear and ensure consistent mating over thousands of cycles.
Advanced Features of the Product
- Electrical 0.5 A max, 10 V AC DC, dielectric 500 VAC for 1 minute, insulation 1000 MΩ min.
- Positions 9 total 8 signal plus card detect.
- Mechanical durability 5000 cycles, typical insertion 10 N max, extraction 0.5 N min.
- Finish gold on contacts; height above board 1.60 mm.
- Operating temperature minus 25 to plus 85 °C.
- These values cover most cellular and IoT controller boards without overbuilding the connector.
Unparalleled Benefits to Users
- Space-saving with positive user feedback, a push-push mechanism, and card detection, simplifies enclosure and firmware design.
- Reliable contact over time, gold-plated contacts, and LCP housing support stable electrical performance through reflow and field use.
- BOM-friendly common Micro SIM footprint with right-angle SMT speeds layout and procurement across global supply chains.