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ATTEND 112G‑TA00‑R Micro SD SIM Combo Connector Push Push SMT Gold Flash 16 Position

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HT Part No. HT304096

Mfr. Part No. 112G-TA00-R

Manufacturer: ATTEND

Technical Documents: Datasheet(datasheets)

699 - In Stock pcs
Price:
£ 1.06
Units Per Unit Price
1 - 699 £ 1.06
700 + £ 0.97
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Product Specification

Product Attributes
Ejector Side Dual
Housing Color Gray
Operating Temperature N/A
Manufacturer ATTEND
Series 112G
Contact Plating Copper Alloy
Card Type Micro Sd Connectors
Height Above Board 2.70mm
Insertion, Removal Method Push-Push
Mounting Type SMT
Number of Pins 8+2/6 Pins
Mounting Feature Normal,Standart-Top
Rohs ROHS
Packaging TAPE&REEL

More Information

The Attend 112G-TA00-R combines a Micro-SD card socket with a SIM card socket in a single, compact module, perfect for embedded and IIoT applications. Engineered for efficient space utilization and reliable performance, this push‑push style connector delivers a dual-card solution tailored for global B2B and technical buyers seeking miniaturized, robust, and cost-effective memory interface solutions. Additionally, with the 112G‑TA00‑R, you get a compact, high-reliability dual-card connector engineered for space-saving embedded designs, backed by strong specifications and global component distribution.

Standout Features of this Micro‑SD Card Socket with SIM Card

  • Connector Type: Push‑push style SIM + Micro‑SD combo socket integrates dual memory interfaces into a single module.
  • Electrical Ratings: Rated up to 100 V AC and 0.5 A maximum current, with 1 GΩ insulation resistance and 500 V AC voltage proof, ensuring reliable electrical performance.
  • Mechanical Durability: Designed for up to 10,000 insertion/removal cycles, with insertion force not exceeding 13.8 N and a push‑in strength of 19.6 N.
  • Material & Build: Insulator crafted from black LCP (Liquid Crystal Polymer), shell made from stainless steel (SUS304), copper alloy contacts with gold flash plating for enhanced corrosion resistance and signal integrity.
  • Size & Package: SMD mounting, tape-and-reel packaging ideal for automated pick-and-place assembly; compact footprint of approximately 18.5 × 17.9 mm with a total height of 2.7 mm and a locating peg for board alignment.

Typical Uses of the Product

This dual-memory socket is ideal for high-density electronics where saving PCB space is critical. It provides the convenience of dual card access in industrial routers, smart meters, vehicle tracking, LTE modules, and IIoT devices. The push‑push mechanism simplifies usability, while the robust design ensures long-term reliability in field deployments.

Notable Advantages to Users

  • Combines SIM and Micro‑SD sockets in a single module.
  • Push‑push insertion/removal with card detect switch.
  • Durable, 10,000-cycle life.
  • Compact SMD footprint with precise locating peg.
  • High electrical integrity with gold-plated contacts.

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