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Samsung Electro‑Mechanics CL10B333KB8NNNC 33 nF 50 V X7R 0603 MLCC Capacitor ±10%

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HT Part No. HT14104

Mfr. Part No. CL10B333KB8NNNC

Manufacturer: SAMSUNG

Technical Documents: Datasheet(datasheets)

672202 - In Stock pcs
Price:
£ 0.0049
Units Per Unit Price
100 - 3999 £ 0.0049
4000 + £ 0.0038
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Product Specification

Product Attributes
Operation Temperature -55C~+125C
Capacitance 33nF
Tolerance 10%
Voltage Rating 50VDC
Dielectric Material X7R
Packaging TAPE&REEL
Manufacturer SAMSUNG
Applications General Purpose
Rohs ROHS
Mounting Type SMT
Package / Case 0603 (1608 Metric)
Length 1.60mm
Width 0.80mm
Height 0.80mm

More Information

Samsung Electro‑Mechanics CL10B333KB8NNNC is a high‑reliability, general‑purpose multilayer ceramic capacitor (MLCC) tailored for global B2B and technical buyers seeking compact, stable decoupling and filtering in space‑constrained PCB designs.

These 0603 (1608 metric) surface‑mount chips deliver 33 nF (0.033 µF) capacitance with ±10% tolerance, rated for 50 V DC, and leverages X7R dielectric for temperature stability from ‑55 °C to +125 °C. At just 1.6 mm × 0.8 mm × 0.8 mm, it minimizes board footprint while offering excellent performance.

Key features include low dissipation factor (~0.025%), insulation resistance of ~10 GΩ, and capacitance change limited to ±15%, making it ideal for decoupling, EM noise suppression, and timing applications. Its robust clay‑polymer X7R dielectric delivers dependable performance across commercial, industrial, and automotive ambient conditions.

Benefits for Design Engineers Include

  • Compact size for high‑density layout and miniaturized electronics.
  • Stable capacitance across temperature and voltage, reducing circuit drift.
  • High insulation resistance and low dissipation factor, enhancing signal integrity.

This CL‑Series MLCC suits decoupling in DC–DC converters, power rails, microcontroller supplies, filters, and general signal‑conditioning circuits. Combining industry‑leading reliability with a tight spec sheet, it stands out in densely packed, performance‑critical boards.

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